Automated Dipping and Solder Exchange
Automated Dipping and Solder Exchange
Micross has designed and developed an automated solder dipping process capable of conforming to GEIA-STD-0006.
The process includes:-
Computer control of a six axis dipping robot.
Solder dipping completed under a Nitrogen blanket.
Solder level sensing for accurate solder dipping.
Integral component wash and dry facility.
Preheating of components to negate thermal shock.
The automated process is capable of handling most package styles but is not limited to them due to innovative handling fixtures.
Typical component packages styles handled to date are:
Semiconductors,
Passives
Electro mechanical components
Integral part of process policing includes XRF measurement of the solder baths and were appropriate solderability checking.
Solderability Checking in line with NPL best practice.
Automated Dipping and Solder Exchange
Automated Dipping and Solder Exchange
Related Posts
About The Author
Micross SXT™ – Solder Exchange Technology
To increase component reliability (and mitigate tin-whisker formation), Micross Components has developed a robotic, automated solder-dipping process that enables us to replace the unwanted finish on a wide range of electronic components, regardless of packaging style.
Learn more: http://americas.micross.com/products-services/robotic-hot-solder-dipping-solder-exchange/
Watch the video: Automated Dipping and Solder Exchange
Robotic Hot Solder Dipping & Solder Exchange
Micross SXT™ (Solder Exchange Technology) is a robotic, automated solder-dipping process developed by Micross Components to increase component reliability and mitigate tin-whisker formation. With Micross SXT™, unwanted finish can be replaced on a wide range of electronic components regardless of packaging style.